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SSPL, DELHI / Defence Miscellaneous Services Defence Stage: Bidding Open
Processing of Epi-Wafer and Fabrication of 976nm Laser Chips and Packaging
Department of Defence Research and Development||Defence Research and Development Organisation||DFMM||Office of DG (MED and COS)||SSPL
Estimated Value
Not Specified
SupplyEMD Guarantee
₹2.97 Lakh
Exemption AllowedTender Fee
₹0
PayableWork Period
240 Days
Execution Timeline Closes in 6 days 15 Oct 2026
BiddingTech OpeningFinancial OpeningAOC Award
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Tender Details
ID: 2026_DRDO_792120_1 Supply
Work Description
Description
Processing of Epi-Wafer and Fabrication of 976nm Laser Chips and Packaging
EMD Amount₹2.97 Lakh
Tender Fee₹0
Bid Due Date
15 Oct 2026, 02:00 pm
Form of ContractSupply
Key Dates & Deadlines
Notice Published
01 Oct 2026, 05:10 pm
GePNIC PublicationDocument Download Window
01 Oct 2026
Until 15 Oct 2026, 02:00 pmBid Submission Due
15 Oct 2026, 02:00 pm
From 02 Oct 2026Technical Bid Opening
16 Oct 2026
Place: ONLINETender Document & BOQ Analysis
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Work Site Location & Geospatial Map
Work location verified under SSPL, DELHI with postal code 110054.
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